BCI Thermal Pad 12.8 W/mK, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED Cooler

BCI Thermal Pad 12.8 W/mK, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED Cooler.

EXCELLENT THERMAL CONDUCTIVITY – thermal pad will significantly improve heat transfer between electronic elements, and rapidly cool down the temperature.

• Laptop
• computer host
• Set top Box
• LID
• LED
• IC SMD DIP
• Auto mechanics
• Power LED
• Electronics
• GPU
• CPU

• WIDE RANGE OF USES: can be used instead of thermal paste or heat sink paste. Great for control board, electronics, CPU, GPU, heat sink, power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, set-top box, LED IC SMD DIP and any cooling modules
• DIMENSIONS: 85 X 45 or 120 X 120, can be cut down to size to suit your need.
• EXCELLENT THERMAL CONDUCTIVITY – thermal pad will significantly improve heat transfer between electronic elements, and rapidly cool down the temperature (thermal silica gel with 12.8W/mK thermal conductivity)
• STURDY AND LONG-LASTING – fire retardant, will perform at temperatures from -40°C up to 200°C, good insulation, wear resistant, non toxic, odorless