BCI Thermal Pad 12.8 W/mK, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED Cooler

Location	In Stock	Qty	ETA
VIC	Yes	560	29/07/2022

WIDE RANGE OF USES: can be used instead of thermal paste or heat sink paste. Great for control board, electronics, CPU, GPU, heat sink, power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, set-top box, LED IC SMD DIP and any cooling modules
DIMENSIONS: 85 X 45, can be cut down to size to suit your need.
EXCELLENT THERMAL CONDUCTIVITY – thermal pad will significantly improve heat transfer between electronic elements, and rapidly cool down the temperature (thermal silica gel with 12.8W/mK thermal conductivity)
STURDY AND LONG-LASTING – fire retardant, will perform at temperatures from -40°C up to 200°C, good insulation, wear resistant, non toxic, odorless

Weight	0.14024 kg
Dimensions	21 × 14 × 4 cm
Size	BCI 0.5mm, BCI 1.5mm, BCI 1.0mm, BCI 0.6mm, BCI 0.8mm, BCI 1.5mm 120120, BCI 1.0mm 120120, BCI 2.0mm 120120, BCI 1.5mm 120120, BCI 2.0mm, BCI 2.5mm, BCI 2.5mm 120*120, BCI 3.0mm